1/*
2 * Copyright (c) 2023 Huawei Device Co., Ltd.
3 * Licensed under the Apache License, Version 2.0 (the "License");
4 * you may not use this file except in compliance with the License.
5 * You may obtain a copy of the License at
6 *
7 *     http://www.apache.org/licenses/LICENSE-2.0
8 *
9 * Unless required by applicable law or agreed to in writing, software
10 * distributed under the License is distributed on an "AS IS" BASIS,
11 * WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied.
12 * See the License for the specific language governing permissions and
13 * limitations under the License.
14 */
15
16/**
17 * @addtogroup thermal
18 * @{
19 *
20 * @brief Provides APIs for managing, controlling, and subscribing to the device temperature.
21 *
22 * After obtaining an object or proxy of this module, the thermal service can invoke related APIs to manage, control,
23 * and subscribe to the device temperature.
24 *
25 * @since 3.1
26 * @version 1.1
27 */
28
29/**
30 * @file ThermalTypes.idl
31 *
32 * @brief Enumerates data types related to thermal management.
33 *
34 * Such data types include thermal information and thermal information list.
35 *
36 * @since 3.1
37 * @version 1.1
38 */
39
40package ohos.hdi.thermal.v1_1;
41
42/**
43 * @brief Defines the device thermal information.
44 *
45 * @since 3.1
46 */
47struct ThermalZoneInfo {
48    /** Device type */
49    String type;
50    /** Device temperature */
51    int temp;
52};
53
54/**
55 * @brief Defines the device thermal information list.
56 *
57 * @since 3.1
58 */
59struct HdfThermalCallbackInfo {
60    /** Device thermal information list */
61    List<struct ThermalZoneInfo> info;
62};
63/** @} */
64